TY  - Generic
T1  - Strain imaging in thermoelectric devices by laser probe shearography
T2  - Proceedings ICT2001. 20 International Conference on Thermoelectrics
Y1  - 2001
A1  - Jorez, S.
A1  - Dilhaire, S.
A1  - Lopez, L. P.
A1  - Granby, S.
A1  - Claeys, W.
A1  - Uemura, K.
A1  - Stockholm, J. G.
KW  - displacement measurement
AB  - <p>We have developed an original optical set-up and method for the measurement of strain in electronic components. We have applied it for the study of thermoelectric devices. The method is based on speckle interferometry imaging called shearography. Two images of a same object lighted by coherent laser light are recorded upon a CCD camera through an appropriate optical system. The two images are slightly shifted one with respect to the other. This allows determining the gradient of normal surface displacement in the direction of the shift. Information taken in this manner in several directions allows to derive a map of a parameter related to the surface displacement gradients that we call &quot;fragility factor&quot;</p>
JF  - Proceedings ICT2001. 20 International Conference on Thermoelectrics
PB  - IEEE
CY  - Piscataway, NJ, USA
ER  - 

TY  - Generic
T1  - Study of the thermal behaviour of PN thermoelectric couples by laser probe interferometric measurement
T2  - Proceedings ICT2001. 20 International Conference on Thermoelectrics
Y1  - 2001
A1  - Patino-Lopez, L. D.
A1  - Dilhaire, S.
A1  - Grauby, S.
A1  - Jorez, S.
A1  - Claeys, W.
A1  - Uemura, K.
A1  - Stockholm, J. G.
KW  - light interferometry
AB  - The purpose of the present paper is to provide experimental data related to the temperature distribution within thermoelectric devices (TE). Moreover our aim is to get this knowledge for a dynamic temperature response of the device. We propose a non-contact optical measuring method, based upon very high-resolution interferometry, to map temperature effects upon the surface of running thermoelectric devices. The Peltier sources within the device generate thermal waves associated to heat transport. These waves interfere when AC current is driven through the device. The interferences are clearly observed in our measurements, showing how heat flows from different sources and merge. The measuring method can be used to check material properties which in turns allows to optimize contact design
JF  - Proceedings ICT2001. 20 International Conference on Thermoelectrics
PB  - IEEE
CY  - Piscataway, NJ, USA
ER  -